Introduction: The MC14 is a BGA memory Ramsink optimized for convection cooling of memory components such as those found in graphic cards. It is the ideal companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.
Features highlights
The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins.
High quality thermal pads: the high quality Berquist thermal tape offers excellent thermal conductivity.
Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled.
Ideal companion to the MCW55 GPU water-block.
Sold in convenenient pack of 8 pieces.
Performance and specifications. Forged C110 copper
14mm (L) x 14mm (W) x 14.5mm (H) Weight: 0.3 oz (8.5 g) C/W: 9.0 (including TIM joint) Maximum recommended heat load: 5 Watts per heatsink We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6°C improvement in component temperature at a 5 Watts heat load.
Test conditions 5 W heat load 25°C ambient Junction temperature 76.8°C 70.3°C
For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125°C (link)
Installation 1-Remove the existing heatsink 2-Carefully clean the surface of the memory modules with a degreaser (Xylene for example) 3-follow the easy installation steps below