Shin-Etsu Microsin G-765 Silicone High performance Thermal Grease
Developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface
contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
As developers continue to create microprocessors that are smaller, faster and hotter than their predecessors, the ability to dissipate the heat generated by
these devices is critical to the overall performance and longevity of the platforms that incorporate them they are in. Shin-Etsu MicroSi is committed to meet
these needs by providing a wide variety of thermally conductive products.
Shin-Etsu Chemical has developed thermal solutions and are the recognized as the world choice leader in thermal interface material (TIM) applications such
as DELL Computers. Excelent solution for air cooling, liquid cooling and phase change applications.
This highly sawed after has a high molecular structure silicone based fluid compound contains thermally-conductive fillers. With their high thermal
conductivity values, this product is ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G-765 has a high
insulation resistance, while sustaning and offering the highest thermal conductivity & long life resistance available.
- Injector with cap for easy application and storage
- 1.0 gm syringe ( Good Things come in small packages )
- Electrically non-conductive
Product Description
Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-765 thermal
interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables
users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management
requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been
successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Data Spec Sheet
Property
Viscosity (Pascal Second)
250
Appearance
Gray
Volatile Content
< 1.0%
Specific Gravity
2.8
Thermal Conductivity(W/m °K)
3.0
Packaging Description
Thermal Grease G-765 1.0 Gram Blue Syringe
Storage Conditions:
60°F to 85°F
Developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface
contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
As developers continue to create microprocessors that are smaller, faster and hotter than their predecessors, the ability to dissipate the heat generated by
these devices is critical to the overall performance and longevity of the platforms that incorporate them they are in. Shin-Etsu MicroSi is committed to meet
these needs by providing a wide variety of thermally conductive products.
Shin-Etsu Chemical has developed thermal solutions and are the recognized as the world choice leader in thermal interface material (TIM) applications such
as DELL Computers. Excelent solution for air cooling, liquid cooling and phase change applications.
This highly sawed after has a high molecular structure silicone based fluid compound contains thermally-conductive fillers. With their high thermal
conductivity values, this product is ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G-765 has a high
insulation resistance, while sustaning and offering the highest thermal conductivity & long life resistance available.
- Injector with cap for easy application and storage
- 1.0 gm syringe ( Good Things come in small packages )
- Electrically non-conductive
Product Description
Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-765 thermal
interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-765 to dissipate heat enables
users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-765 is designed to meet current and future thermal management
requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been
successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Data Spec Sheet
Property
Viscosity (Pascal Second)
250
Appearance
Gray
Volatile Content
< 1.0%
Specific Gravity
2.8
Thermal Conductivity(W/m °K)
3.0
Packaging Description
Thermal Grease G-765 1.0 Gram Blue Syringe
Storage Conditions:
60°F to 85°F
Shin-Etsu Microsin G-765 Silicone Thermal Grease
G-765
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