Danger Den DD-M6 Nickel CPU Block - LGA 2011, 1155/1156, 1366, 775
The Best Performing Danger Den Block!
The DD-M6 CPU waterblock is designed to provide optimum performance to the Multi-Core and Multi-Die.
Works with the new LGA 2011, 1366, 1155, 1156. 775 sockets.
The Best Performing Danger Den Block!
The DD-M6 CPU waterblock is designed to provide optimum performance to the Multi-Core and Multi-Die.
Works with the new LGA 2011, 1366, 1155, 1156. 775 sockets.
Danger Den DD-M6 CPU Block (Nickle Plated Version)
| Angled Micro Fin Design |
| Included Components |
| Smoothly lapsed Copper Base |
Features:
•100% copper 110 Base with Micro Fins
•EN Nickel Plated Mid Plate and Top
•*NEW* Stealth Spring Mounting System
•1/8" Powder Coated Steel Hold Down
•Threaded fitting ports are G 1/4 BSPP
•Complete Block with all O-Rings
•Pressure Tested to 50psi
•Fittings sold separately
•Machine lapped and flat mirror polished
Benefits:
•58 Heat Dissipating Fins at a 0.5mm pitch and 0.25mm channel. Providing enhanced transfer of heat to the water and optimum coverage of the CPU
•Significant temperature drops on high TDP processors and major Overclocks. Observed over 7C drop versus MC-TDX.
•Ready to install designed and tuned for your system for top performance
•Anti-Tarnish coating applied to prevent finger print or environmental changes. This specialized formula also has no affect on cooling potential.
•Corrosion will not occur when used with other Copper and Brass parts. Avoid using non-anodized aluminum (or all aluminum) if at all possible for maximum
component life.
Notes:
•Verify proper mount before power up. Check the thermal compound imprint and verify the block isn't touching any capacitors.
•Optional backplate is 1/8" acrylic and covers the Intel Backplate. A gasket surround the Intel backplate for additional protection.
Pressure and Flow Data: Performed Independently by Martin's Liquid Lab:
•100% copper 110 Base with Micro Fins
•EN Nickel Plated Mid Plate and Top
•*NEW* Stealth Spring Mounting System
•1/8" Powder Coated Steel Hold Down
•Threaded fitting ports are G 1/4 BSPP
•Complete Block with all O-Rings
•Pressure Tested to 50psi
•Fittings sold separately
•Machine lapped and flat mirror polished
Benefits:
•58 Heat Dissipating Fins at a 0.5mm pitch and 0.25mm channel. Providing enhanced transfer of heat to the water and optimum coverage of the CPU
•Significant temperature drops on high TDP processors and major Overclocks. Observed over 7C drop versus MC-TDX.
•Ready to install designed and tuned for your system for top performance
•Anti-Tarnish coating applied to prevent finger print or environmental changes. This specialized formula also has no affect on cooling potential.
•Corrosion will not occur when used with other Copper and Brass parts. Avoid using non-anodized aluminum (or all aluminum) if at all possible for maximum
component life.
Notes:
•Verify proper mount before power up. Check the thermal compound imprint and verify the block isn't touching any capacitors.
•Optional backplate is 1/8" acrylic and covers the Intel Backplate. A gasket surround the Intel backplate for additional protection.
Pressure and Flow Data: Performed Independently by Martin's Liquid Lab:
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